Sputtering System｜Load-lock type｜Products

Model: ENTRON-EXX

The system is a versatile, multi-chamber platform designed to support the production of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging.

Model：uGmni-300S

Multi-Chamber Sputtering System for High-Volume Production of Power, Opto, and RF Devices.

Model： SME

Multi-Chamber Sputtering System for Opto Devices, Packaging, MEMS/Electronic Components, Power Devices, and Communication Devices

Model： SRH

Production-Scale Multi-Chamber Sputtering System Optimized for Packaging and Power Devices Applications.

Model:SEGul-200

Multi-Chamber Sputtering System for High-Volume Production of GaN Devices for Power, Opto, and RF Applications.

Model： CS

Single-Chamber Sputtering System for R&D to Small-Scale Production.

Model： SMV

Multi-Chamber Vertical Sputtering System for Ti/Cu Seed Layer Formation in PLP Packaging.

Model：SIV, SCV

In-line Vertical Sputtering System Suitable for Deposition of Various Materials on a Wide Range of Substrates.

Model： SIH, SCH

In-line Sputtering System Suitable for Deposition of Various Materials on a Wide Range of Substrates.

Model： SV

High-Throughput Batch-Type Drum Sputtering System.

Model： SMD

This is one of the Model: SMD with a total sales record of over 1,400 units. It is a multi-chamber sputtering system primarily used in the high-definition display industry.

Model： SMD

This is one of the Model: SMD with a total sales record of over 1,400 units. It is a In-line sputtering system primarily used in the large display industry.