Model: SIH, SCH|Sputtering System|Products|ULVAC, Inc.
Sputtering System

Model: SIH, SCH

These systems are ideal for depositing a variety of materials and can accommodate a wide range of substrates. Featuring ULVAC's proprietary transfer system, they offer excellent cost performance and provide a highly versatile solution for various applications, making it an ideal in-line type deposition systems.

Features

  • Continuous automated production enabled by the stocker chamber.
  • Low cost.
  • Achieves space-saving and reduced wiring.
  • Easy substrate size change with the carrier transfer system.

Applications

  • Electronic device

Specification

Model SIH SCH
Deposition method Pass-by
Deposition direction Up or Down

This website use cookies to obtain and use access data to understand the convenience and usage of customers. If you agree to use cookies, click "I Accept".
[Privacy Plicy] [Cookie Policy]

I Accept