Technology History|R&D|ULVAC, Inc.

Technology History

1952 August The company was established. At the same time, Hayashi Chikara and Hashimoto Koichi from the Sagane Lab at Tokyo University and Shibata Hideo from Kumagai Lab joined us.
1954 November The rotary cooler was developed.
1957 September The 100 kg induced heating vacuum furnace was produced domestically.
1959 September The "study on vacuum melting metal casting furnace using uranium and uranium alloy" supported by an atomic energy subsidy from the Science and Technology Agency was successful.
1961 March The compact diffusion pump won the incentive award from the director-general of the Science and Technology Agency.
The "60 kW electron impact vacuum furnace" was completed, thanks to a subsidy from the Ministry of International Trade and Industry.
1962 November The ultra high vacuum valve won the incentive award from the director-general of the Science and Technology Agency.
1963 November The titanium casting valve won the Agency of Industrial Science and Technology director's award.
1965 November The large-scale space chamber was delivered to the space research lab at Tokyo University.
1967 March The low-speed electronic diffraction device won the gold prize at the Leipzig international trade fair.
1968 November The electrical lead for superconductive magnets was successfully developed, which was commissioned by the New Business Development Body.
December The automatic leak test (ALT) system was developed.
1969 October The low-frequency dissolution degasification furnace (25 tons) was completed for the first time in Japan.
1970 January The mass-filter type mass spectrometer was developed.
February The world's largest plasticizer plant was completed.
October The high-frequency continuous sputtering system was developed.
1974 January Transparent conductive film was developed.
October The world's largest vapor-phase dryer was completed.
December The pumping system for the atomic fusion laboratory was completed, which was to be delivered to the Japan Atomic Energy Research Institute, Tokai laboratory.
1975 June The first domestic ion implantation system was developed.
October IBM in the U.S. placed a major order for the full automatic vacuum evaporation system.
1976 April An ion carburizing system was developed.
October The cassette-to-cassette sputtering system was developed.
1979 January The plasma CVD system was developed.
1980 May The fully automatic helium leak detector was developed.
The photochemical smog chamber was developed and delivered to the Research Institute for Environmental Protection and received a letter of appreciation from the Minister of Construction.
September The super-sized vacuum heat treatment furnace for rockets was completed.
1982 February The large current ion implantation system IM-80H was developed.
1985 March The vacuum pumping system for the critical plasma tester (JT-60) was delivered to the Japan Atomic Energy Research Institute, Naka laboratory.
November Vacuum Metallurgical Co., Ltd. delivered a Ti alloy cast metal elbow casing, the heart of the H-II rocket engine.
December The world's first multi-chamber sputtering system MCH-9000 series was launched.
1987 September The metal CVD system ERA-1000 won the IR-100 and received an award in Chicago.
December The magnetic levitation transport system was developed in collaboration with Yasukawa Electric Corporation.
1988 May The sputtering system for the superconductive film deposition "SH series" was launched.
October The ashing system "UNA-2000" was developed.
1989 May The sputtering system for the low-resistance ITO films "SDP series" was developed.
August Tsukuba Institute for Super Materials developed a "high-molecular thin film using vapor deposition polymerization."
1990 January The Bank of Canada issued new 50-dollar bills with a bogus bill prevention device using our vacuum evaporation roll coater.
1991 December The CERAUS series, a multi-chamber deposition system for ultra-high vacuum used in semiconductor manufacturing was launched.
1993 January The vacuum degreasing cleaning system for de-chlorofluorocarbon/ethane was developed.
May The high-performance sputter ion pump for the extra/ultra-high vacuum "Acter Pump" was launched.
1993 October The method to accurately measure the materials for extra high vacuum, which emit extremely fewer gases, and those emitted gases was developed.
1994 September The low pressure long through sputter (LTS) method for the next-generation semiconductor processes was developed.
1995 February The sputtering system for manufacturing the liquid crystal display panels "SMD-450" won the Nikkei Excellent Product of the Year '94.
April Fuji Susono plant obtained ISO 9001 certification.
September The helium leak detector "HELIOT 301" won the "1995 Good Design Product, Selected by the Ministry of International Trade and Industry."
1996 July "IL-100," the ion implantation system for manufacturing the next-generation liquid crystal display panels, won the '96 Excellent Award of the Advanced Display of the Year.
1997 April The helium leak detector "HELIOT" won the 27th New Machine Development award held by the Japan Society for the Promotion of Machine Industry.
A cooperative development contract regarding highly dielectric thin film deposition was concluded with Ramtron International Corporation, aiming for mass production of FRAM, a next-generation semiconductor memory.
May Three organic EL generators were developed and launched.
July The "MgO film evaporation system ECH series" for plasma displays won the '97 championship of the 2nd Advanced Display of the Year.
1998 April The NLD plasma source high-density etching system "NLD-8000/800" was developed.
The Components Division obtained ISO 9001 certification.
July The Electronics Equipment Group, Electronics Equipment Division 1, Electronics Equipment Division 2, Control Solution Division, Purchasing Department, Delivery Department and other related departments obtained ISO 9001 certification.
The sputtering system for LCD manufacturing "SMD-850" won the '98 Excellent Award of the 3rd Advanced Display of the Year.
VLSI Research, the semiconductor related audit corporation, appraised us as "the system supplier that has made the most outstanding improvements."
1999 March The Ultra-high Vacuum Division and Control Equipment Division obtained ISO 9001 certification.
April Semiconductor Equipment Division 2 obtained ISO 9001 certification.
We tied up with Ramtron International Corporation to develop "a next-generation ferroelectric memory."
July The "plasma CVD system for low-temperature poly-silicon TFT production CMD-450BHT" won the '99 championship of the 4th Advanced Display of the Year.
The "multi-cathode sputter (MCS)" for barrier film deposition for the next-generation Cu wires and "CVD technologies for WN" were developed.
VLSI Research, the semiconductor related audit corporation, selected us as one of the "10 companies that achieved excellent customer satisfaction in 1999," meaning that we have won their prizes for two successive years.
November The Industrial Equipment Division obtained ISO 9001, which means all divisions and departments across the company were certified.
Sputter technology for the next-generation Cu wires "Self Ionized Sputtering (SIS)" was developed.
The inexpensive and compact metallization system for mass production, supporting 300 mm wafers, "ENTRON" was developed.
2000 April Technical cooperation was established with Kodak and Sanyo Electric Co., Ltd. to develop organic EL display manufacturing equipment.
July The organic EL generator "SATELLA" won the championship of the 5th Advanced Display of the Year in the equipment sector.
VLSI Research, the semiconductor related audit corporation, selected us as one of the "10 companies that achieved excellent customer satisfaction in 2000," meaning that we have won their prizes for three successive years.
August The new model Low-K material was announced.
2001 March Compact and inexpensive liquid crystal implantation/sealing equipment for large-scale liquid crystal panels was announced.
July The large-scale film deposition system using the Cat-CVD method was developed.
2002 March The large-area high-intensity flat-faced lamp was developed.
June Visible light photocatalysis film deposition and evaluation systems were announced.
December Cu wiring technology using the bias modulation SIS (Self Ionized Sputtering) method was announced.
Ultra-high vacuum sputtering equipment for the mass production of TMR films for MRAM was developed.
Al filling technology using aluminum (Al) CVD technology was developed.
2003 January The dry pump power saving attachment "ECO-SHOCK" won the "23rd Japan machinery Federation presidential prize" of The Japan Machinery Federation.
May Polyimide film coverage technology using vapor deposition polymerization was developed.
May Dry pump power-saving attachment [Eco-Shock] won the Third Japan Vacuum Industry Association/Japan Industrial Journal Chairman's Award for 2003Winner of Chairman's Award, Japan Machinery Federation's 23rd Award for Outstanding Environmental Machinery.
August The solid-state green laser anneal system for low-temperature poly-silicon/TFT was developed (with the "high-power 200W green laser oscillator" developed by Sanyo Electric Co., Ltd. mounted).
November The MEMS process line such as lithography was maintained and the integrated line from film deposition/etching to dicing and bonding was set up and MEMS foundry services were provided.
2004 February A new license contract was concluded with JDS Uniphase Corporation.
2005 April New products, the liquid crystal dropping and gluing system "V series," PDP panel function tester "BM series," ashing system "NA-1000/1300," etching system "ALBA," and wafer bump inspection system "IS-300/3300" were announced.
May The carbon nano tube growth system that allows the world's first vertical and selected growth on the board (for semiconductors) and the arc carbon nano tube (single wall type) production system were announced.
In the 5th awarding ceremony of the Japan Vacuum Industry Association, the "development of low-resistance ITO conductive film" won the FujiSankei Business i. president award and "contribution to vacuum system production using a Ti welding process" won the technique award.
July The multi-purpose single-chamber vacuum heat treatment system (FHB series) mounting our technology, the high purity gas shield method, was brought to the domestic market.
November ULVAC introduces two new models of ion implantation systems (SOPHI, IH‐860DSIC) into the power device market.
2006 June Latest Type Double-Arm Vacuum Transfer Robot ULSTA-300 with throughput improvement was announced.
New chromatogram processor ChromatoDAQ II designed for RoHS compliance, compactness and high performance was announced.
July Launching the low k inter-layer insulating film materials and wafers with insulating film for next-generation LSI.
August Developed anti-corrosion treatment for Al alloy with little outgassing (Super AL-pika).
September Launched the sale of new-model sputtering equipment for automotive parts. Achieved high productivity by three-layer continuous processing, as well as space saving and environmental compliance.
Launched the Qulee (pronounced as "KLEE") Series, residual gas analysis/process gas monitor achieving ultra low-cost and pursuing facilitation and convenience.
Developed the new technology of manufacturing MEMS PZT piezoelectric devices.
Linear ion guns with improved initial discharge current characteristics launched.
Marketing of long-life radio-frequency (RF) ion guns commenced.
October Developed the technology of growing an SiGe epitaxial layer at low temperature
Selective epitaxial SiGe application to SOI and source/drain possible -
Extended deployment of leading edge optical coating platform
November Launched the new-model QCM based Modecular Interaction Analyzer "AFFINIX Q series" AFFINIX QN
2007 January Launched the new-model sputtering system jsputter "JSP-8000"
March NexPower Technology Corporation is going to enter the solar cell market. ULVAC made a package contract for the production systems.
April The "Sputtering system SDP-s series for the 8th generation or later liquid crystal CF/PDP" won the grand prize for the ADY2007 production system department.
June Developed a new film formation technology for high-integrated PCRAM
-GST(Ge2 Sb2 Te5 )film embedding sputtering has been realized-
August Sunner Solar Corporation is going to enter the solar energy market. ULVAC made a package contract for the production systems.
Developed a new process technology for manufacturing magnetic heads for next-generation HDDs
October China Solar Power enters thin film solar cell market in China by forging strategic alliance with ULVAC, Inc. of Japan
November Launched the sale of NE-950, the dry etching system dedicated for LED/LD mass-production targets five times productivity
2008 January Release of new models of inline sputtering systems supporting 8.5th to 10th generation CF substrates achieving high throughput and process stability
February Developed the Cu wiring process for TFT: adhesion and barrier performance improved by Oxygen-mixture sputtering
March Developed the carbon nanotube film formation system for 300-mm wafers
Developed and Launched the sales of "Magrise": a mass-production system for the world's highest grade rare-earth permanent magnets, the first system ever to improve magnet performance while saving Dy
April Sales start of vacuum evaporation system for color reflectors
May Launched the sales of sputtering system for non-conductive metal coating
July Launched the sales of CEH-400BII,new type of centrifugal vacuum distillation system
November Launched the sale of LED mass-production-dedicated dry etching system NE-950EX: productivity up 140% over the current standard
December Developed the world's first integrated mass production technology for thin-film lithium secondary batteries
Introduced the high productivity resist/residue removal tool ENVIROTM-Xceed400
Announced the establishment of world's first solar cell modules testing laboratory as an equipment manufacturer with the vooperation of TÜV Rheinland Japan Ltd.
Launched the world's most sensitive residual gas analyzer/process monitor Labeled model number HGM-202 in the Qulee series, this top performer can be used in ultra high vacuum or extra-high vacuum environments.
2009 January ULVAC's Turnkey Production Line of a-Si Thin film Solar Cell Received a Nihon Keizai Shimbun Awards for Excellence in the 2008 Nikkei Superior Products and Services Awards.
2010 June Japan's First JCSS Vacuum Gauge Calibration Laboratory
July Technical collaboration with a subsidiary of SABIC Innovative Plastics Holdings BV for mass production of plasma coating technology
October Tie-up with Optorun to Fuel Sales of Optical Thin Film Deposition Systems
2011 February Recipient of the first "Kanagawa Award for the Prevention of Global Warming" for Development of a photovoltaic quick-charging system for electric vehicles
May Developed the portable small-scale power generation system
July Established the South Korea Institute for Super Materials as a research institute attached to ULVAC KOREA, Ltd. to enhance research and development in South Korea.
2013 September At the 11th Excellent Contribution to Industry-Academia-Government Collaboration Award Ceremony, the National Institute of Advanced Industrial Science and Technology (AIST) and Fuji Electric Co., Ltd. Jointly Received the Japan Business Federation Chairman's Award.
2015 April ULVAC, Inc. and Robert Bosch GmbH Sign Basic Agreement for Joint Development of Piezoelectric Device (PZT) for MEMS
July Established Future Technology Research Laboratory
2017 March Dry Etching System "NA-1500" for 600mm Advanced Packaging Substrates --- NA-1500 provides uniform Descum process for large square substrate
S-QAM series of complex sputtering systems for R&D launched
June Dry Agreement Signed to Establish Joint Research Office with the Chinese Academy of Sciences' Institute of Microelectronics
2018 April Dry ULVAC to Develop and Launch the LS series of Dry Vacuum Pumps - High pumping speed combined with low power consumption -
November Established ULVAC-Osaka University Joint Research Laboratory for Future Technology in Graduate School of Engineering, Osaka University
2019 February Invited lecture in SPIE
November ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors /Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices

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