ULVAC will be presenting on the newest of plasma technology to fabricate advanced packaging at ECTC 2022.

Date	May 31 - June 3, 2022
Title 1	The investigation of dry plasma technology in each steps for the fabrication of high performance redistribution layer
Title 2	A novel plasma process for build-up film in the fine wiring fabrication

Details information on the presentations, including session number, presentation schedule, and authors, will be published in vacuum magazines, as soon as we receive it from ECTC.
https://www.ulvac.co.jp/wiki/en/process_g_ectc2022/

External Links

- https://www.ectc.net/

ULVAC Product Links

- Ashing
https://www.ulvac.co.jp/en/products/ashing_system/index.html
- Packaging
https://www.ulvac.co.jp/en/products/applications/advanced_packaging_device/index.html
- Details（Vacuum Magazine)
https://www.ulvac.co.jp/wiki/en/process_g_ectc2022/

For further information

ULVAC, Inc. web_info