2022 ICEP ULVAC

2022 International Conference on Electronics Packaging (ICEP), the most prestigious package conference in Japan, will be held as hybrid conference from May 11th to May 14thULVAC is “Gold sponsor” of ICEP.
2022 ICEP ULVAC

VCSEL fabrication flow

The market for semiconductor lasers is becoming active as a light source for 3D sensing technologies such as LiDAR, which are required for autonomous driving. As one of them, we will introduce a dry process for VCSELs (Vertical Cavity Surface Emitting Laser), which has merits such as miniaturization and energy saving.
VCSEL fabrication flow

MicroLED manufacturing

MicroLED is a technology for refining LEDs used as light sources such as lighting and applying them to displays, and is expected as a technology to realize the next generation of displays of liquid crystal and organic EL. ULVAC provides technologies such as ITO sputtering and etching for the MicroLED manufacturing process.
MicroLED manufacturing