2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), the most prestigious package conference in Japan, will be held from May 31st to June 3h.
2022 International Conference on Electronics Packaging (ICEP), the most prestigious package conference in Japan, will be held as hybrid conference from May 11th to May 14th. ULVAC is “Gold sponsor” of ICEP.
… 2022 ICEP ULVAC
Introducing the ion implantation technology required for the IGBT process.
ULVAC provides technologies such as ion implanters and sputtering equipment for the manufacturing process of power device IGBTs. Power device IGBT (Insulated Gate Bipolar Transistor) is an acronym for Insulated Gate Bipolar Transistor.
Introducing the dry etching technology required for the optical waveguide process.
… Process technology for Waveguide
An optical waveguide is a transmission line that uses light for communication. Quartz-based optical waveguides are basically manufactured using quartz-based glass film deposition technology and etching micromachining technology.
… Waveguide fabrication flow
Introducing the dry etching technology required for the VCSEL process.
… Process technology for VCSEL
The market for semiconductor lasers is becoming active as a light source for 3D sensing technologies such as LiDAR, which are required for autonomous driving. As one of them, we will introduce a dry process for VCSELs (Vertical Cavity Surface Emitting Laser), which has merits such as miniaturization and energy saving.
… VCSEL fabrication flow
Introducing the sputtering and etching technologies required for the MicroLED process.
… Process technology for MicroLED
MicroLED is a technology for refining LEDs used as light sources such as lighting and applying them to displays, and is expected as a technology to realize the next generation of displays of liquid crystal and organic EL. ULVAC provides technologies such as ITO sputtering and etching for the MicroLED manufacturing process.
… MicroLED manufacturing