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2025

2025.11.28 News: Invited Talk at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025)

2025.11.21 News: ULVAC Receives "Best Partner Award" from SK hynix ―Recognized for Continuous Commitment to Technical Excellence and Quality Improvement

2025.11.20 News: ULVAC to Exhibit at "VACUUM2025"

2025.09.19 News: The latest issue of Technical Journal No.86E has been published.

2025.09.12 News: Managing Executive Officer Junya Kiyota of ULVAC, Inc. Receives Special Award at "Nikkei XTECH CTO of the Year 2025"

2025.09.03 News: Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

2025.09.02 News: The 86th JSAP Autumn Meeting 2025

2025.08.21 News: Notification of additional funding to "Hayashi-ULVAC MISTI Seed Fund"

2025.08.13 News: Fuji Susono Factory Achieves 100% Equivalent Renewable Energy

2025.07.28 News: Joint Research | The University of Osaka Announces Launch of "Fully Japan-Made" Quantum Computer on July 28―Equipped with a Dilution Refrigerator Developed by ULVAC

2025.07.28 News: Plenary Speech and Invited Talk at the 26th International Conference on Electronic Packaging Technology (ICEPT 2025)

2025.07.23 Product Termination and Maintenance: End of support and maintenance related to Leak detector HELIOT 710 series

2025.06.19 News: Presentation at the 2025 NNCI Etch Symposium

2025.06.19 News: ULVAC Continues Participation in "Lab-in-Fab" Project to Advance Piezoelectric MEMS Technology, Now Entering a New Phase

2025.06.16 News: Invited Talk at IPTJC 2025

2025.06.10 News: ULVAC Received the "Best Interactive Presentation Award" at the IEEE 74th ECTC, the World's Largest International Conference in the Field of Electronic Packaging

2025.05.30 News: ULVAC Group Receives Awards in Three Categories at the 2024 JVIA Awards

2025.04.25 News: The 2025 IEEE 75th Electronic Components and Technology Conference (ECTC 2025)

2025.04.24 News: ULVAC Develops Dilution Refrigerator for Quantum Computers - Supporting Japan's First Fully Domestic Quantum Computer with Cryogenic Innovation

2025.04.07 News: 2025 International Conference on Electronics Packaging Joined with iMAPS All Asia Conference (ICEP-IAAC 2025)

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