ULVAC and IBM will be presenting on a novel metal gate technology developed for next generation logic devices at 65th International Electron Devices Meeting (IEDM2019) in San Francisco.
Title: "Ultra-scaled Conformal Scavenging Electrode with Superior Tunability for Short-channel RMG FinFET Workfunction and all-ALD 3D-compatible ReRAM"
Date: December 11, 2019 2:50 p.m. (Session36)
・ 2019 IEDM PROGRAM
ULVAC, Inc. web_info