ULVAC and IBM will be presenting on a novel metal gate technology at 65th International Electron Devices Meeting (IEDM2019)

ULVAC and IBM will be presenting on a novel metal gate technology developed for next generation logic devices at 65th International Electron Devices Meeting (IEDM2019) in San Francisco.

Title: "Ultra-scaled Conformal Scavenging Electrode with Superior Tunability for Short-channel RMG FinFET Workfunction and all-ALD 3D-compatible ReRAM"

Date: December 11, 2019 2:50 p.m. (Session36)

External Links

・ IEDM

https://ieee-iedm.org/

・ 2019 IEDM PROGRAM

https://ieee-iedm.org/wp-content/uploads/2019/10/session-36.pdf/

For further information

ULVAC, Inc. web_info