The Technology Award from JIEP|News|ULVAC, Inc.
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The Technology Award from JIEP

ULVAC's plasma processing technology for high-density packaging received the Technology Award from the Japan Institute of Electronics Packaging(JIEP).
This award recognizes technologies that the academic society has made a significant contribution to the development of electronics packaging technology.

We gave an invited talk on June 4th.

"The Novel Ashing and Etching Technology for Fan-Out Wafer Level Package"

External Links(Japanese site)

ULVAC Product Links

For further information

ULVAC, Inc. web_info

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