ULVAC's plasma processing technology for high-density packaging received the Technology Award from the Japan Institute of Electronics Packaging（JIEP）.
This award recognizes technologies that the academic society has made a significant contribution to the development of electronics packaging technology.
We gave an invited talk on June 4th.
"The Novel Ashing and Etching Technology for Fan-Out Wafer Level Package"
ULVAC, Inc. web_info