Sputtering System
Model：SIV, SCV
These systems are ideal for depositing a variety of materials and can accommodate a wide range of substrates. Featuring ULVAC's proprietary transfer system, they offer excellent cost performance and provide a highly versatile solution for various applications, making it an ideal in-line vertical pass-by type deposition systems.
Features
- Continuous automated production enabled by the stocker chamber.
- Low cost.
- Achieves space-saving and reduced wiring.
- Easy substrate size change with the carrier transfer system.
Applications
- Electronic device
Specification
| Model | SIV | SCV |
| Deposition method | Pass-by | |
| Deposition direction | Side | |