Sputtering System
Model：uGmni-300S
Flexible configuration of up to six process chambers, depending on the core shape, enables this multi-chamber sputtering system to support a wide range of applications, including power devices, opto-devices, and RF devices.
Features
- Compatible with various applications.
- Substrate size:Up to Φ300mm.
Applications
- Power device: seed and metal layer sputtering
- MEMS sensor: PZT sputtering and etching
- Optical device: VCSEL etching
- Packaging: Descum ashing
- Communication device: PE-CVD of insulated film and etching
