Sputtering System
Model： SRH
Production-scale sputtering system ideal for packaging and power device applications. Metal deposition is performed with high precision, forming reliable connection layers.
Features
- Supports ultra-thin wafers (automatic transport capability for wafers as thin as 50μm).
- ESC technology enables efficient cooling.
- Capable of handling five different materials (Al, AlSi, Ti, Ni, Au or Ag).
- Equipped with sputter etching using ISM technology, enabling pre-cleaning.
- Substrate size: 125mm to 200mm.
Applications
- Power device
- WL-CSP (seed layer of electrolytic plating)
- UBM (Barrier metal)
