Sputtering System
Model： SMD
This is one of the Model: SMD with a total sales record of over 1,400 units. It is a multi-chamber sputtering system designed for forming metal films, ITO, IGZO, dielectric films, and more, primarily used in the large display industry.
Features
- Wide range of deposition processes are supported, based on ULVAC's abundant experience and data.
- High productivity
- Automated film process tuning technology.
Applications
- TFT (Thin-film transistor) for large displays
Specifications
| Model | G8.5～G8.6 | G10.5 | |
| SMD-2400F | SMD-3400 | ||
| Substrate size (mm) | 2200 × 2500 ～ 2290 × 2620 | 2940 × 3370 | |
| Deposition method | Side deposition method substrate-fixed deposition | ||
| Chamber configuration | 1) Loading/Unloading position | 1 | |
| 2) Loading/Unloading chambers | 1 | ||
| 3) Heating chambers | 1 | ||
| 4) Sputter chambers | Max 4 | ||
| High vacuum evacuation system | Turbo molecular pump | ||
| Substrate transfer system | Tray + magnetic levitation transfer system | ||