Flexible installation of process chambers ranging from 1 to 7, depending on the core shape, allows the sputtering deposition system to meet a wide range of process needs, including opto-devices, packaging, MEMS/electronic components, power devices, and communication devices, while achieving high cost performance.
Model | SME-200E | SME-200J | SME-200 | |
Substrate size (mm) | Up to Φ200 | |||
Deposition direction | Down | |||
Chamber configuration | 1) Loading/Unloading chambers | 1 | 1 | 1 or 2 |
2) Transfer chambers | Square | Hexagon | Octagon | |
3) Sputtering chambers | Max. 3 | Max.5 | Max.7 | |
High vacuum evacuation system | TMP or 8" cryo pump | |||
Substrate transfer system | Vacuum transfer robot(Single arm type) | Vacuum transfer robot(One arm Double Pick) | Vacuum transfer robot(Double arm type) |
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