Sputtering System
Model： SME
Flexible installation of process chambers ranging from 1 to 7, depending on the core shape, allows the sputtering deposition system to meet a wide range of process needs, including opto-devices, packaging, MEMS/electronic components, power devices, and communication devices, while achieving high cost performance.
Features
- Supports process modules dedicated to various applications.
- Capable of substrate heating, simultaneous deposition, and rotating deposition.
- Process chambers can accommodate 1 to 7 chambers.
- Substrate size：Up to Φ200mm.
Applications
- Electronic device
- MEMS
- Power device
- LED
- Communication device
Specifications
| Model | SME-200E | SME-200J | SME-200 | |
| Substrate size (mm) | Up to Φ200 | |||
| Deposition direction | Down |
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| Chamber configuration | 1) Loading/Unloading chambers | 1 | 1 | 1 or 2 |
| 2) Transfer chambers | Square | Hexagon | Octagon | |
| 3) Sputtering chambers | Max. 3 | Max. 5 | Max. 7 | |
| High vacuum evacuation system | TMP or 8" cryopump | |||
| substrate transport system | Vacuum transfer robot(Single arm type) | Vacuum transfer robot (One arm Double Pick) | Vacuum transfer robot(Double arm type) | |
