Model: SMV|Sputtering System|Products|ULVAC, Inc.
Sputtering System

Model: SMV

A sputtering system used for depositing seed layers (Ti/Cu) in the PLP (Panel Level Package) process, offer excellent cost performance.

Features

  • Substrate reversing mechanism supports double-sided deposition.
  • Low-temperature deposition with high productivity.
  • Substrate holding mechanism designed for thin wafers.
  • High adhesion properties.
  • Vertical static deposition.
  • Substrate size:500 to 600mm square.

Applications

  • Panel packaging

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