Sputtering System
Model： SMV
A sputtering system used for depositing seed layers (Ti/Cu) in the PLP (Panel Level Package) process, offers excellent cost performance.
Features
- Substrate reversing mechanism supports double-sided deposition.
- Low-temperature deposition with high productivity.
- Substrate holding mechanism designed for thin wafers.
- High adhesion properties.
- Vertical static deposition.
- Substrate size：500 to 600mm square.
Applications
- Panel packaging