Sputtering System
Model： SV
A vertical batch-type drum sputtering system capable of processing a large number of substrates. Designed as a simple and general-purpose model, it meets a wide range of needs.
Features
- The rotary drum type allows for the processing of multiple substrates at once, making it ideal for small to medium-scale production or low-volume, high-variety production.
- Supports square substrates and thick-film deposition.
Applications
- Deposition of electrode films, insulating films or dielectric films on various substrates
Specifications
| Model | SV-4540 | SV-6040 | SV-9040 |
| Standard pumping system | 12-inch cryopump | 12-inch cryopump | 16-inch cryopump |
| Final pressure | 6.7e-5Pa | 6.7e-5Pa | 6.7e-5Pa |
| Deposition direction | Side | Side | Side |
| Deposition area uniformity Static Rotary |
L300mm±10% | L300mm±10% | L400mm±10% |
| Substrate heating | 250℃ | 250℃ | 250℃ |
| Control System | Automatic | Automatic | Automatic |
| Options (except SV-200) |
Turbo pump | Drainage cold electrode | |
| Oil diffusion pump | APC mechanism | ||
| Simultaneous multi-source deposition | Substrate reversing mechanism | ||
| Down deposition | Reactive sputter | ||
| Conventional cathode | |||
| Cathode for strong magnets | |||
| RF etch cleaning (SV-4540) | |||
| Bias mechanism (SV-4540) | |||
