A vertical batch-type drum sputtering system capable of processing a large number of substrates. Designed as a simple and general-purpose model, it meets a wide range of needs.
Model | SV-4540 | SV-6040 | SV-9040 |
Standard pumping system | 12-inch cryopump | 12-inch cryopump | 16-inch cryopump |
Final pressure | 6.7e-5Pa | 6.7e-5Pa | 6.7e-5Pa |
Deposition direction | Side | Side | Side |
Deposition area uniformity Static Rotary | L300mm ± 10% | L300mm ± 10% | L400mm ± 10% |
Substrate heating | 250°C | 250°C | 250°C |
Control system | Automatic | Automatic | Automatic |
Options (except SV-200) | Turbo pump | Drainage cold electrode | |
Oil diffusion pump | APC mechanism | ||
Simultaneous multi-source deposition | Substrate reversing mechanism | ||
Down deposition | Reactive sputter | ||
Conventional cathode | |||
Cathode for strong magnets | |||
RF etch cleaning (SV-4540) | |||
Bias mechanism (SV-4540) |
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