Model: CS|Sputtering System|Products|ULVAC, Inc.
Sputtering System

Model: CS

This is a single-chamber sputtering system designed to support applications from research and development to small-scale production. It has been redesigned with a focus on ease of use, leveraging existing process data and expertise.

Features

  • Supports multi-layer deposition.
  • Capable of data logging.
  • Substrate size: Up to Φ300mm (deposition performance is guaranteed up to Φ190mm).
  • Automated multi-layer deposition enabled through recipe control.
  • The load-lock chamber cassette can accommodate up to 5 trays, which are automatically transferred by a manipulator.

Applications

  • R&D, and small-scale production for electronic components

This website use cookies to obtain and use access data to understand the convenience and usage of customers. If you agree to use cookies, click "I Accept".
[Privacy Plicy] [Cookie Policy]

I Accept