High-Density Plasma Etching System for R&D NE-550EX|Etching System|Products|ULVAC, Inc.
Etching System

High-Density Plasma
Etching System for R&DNE-550EX

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.


  • Equip with low-pressure, low-electron-temperature and high-density plasma source.
  • Supports wide range of process control from ion etching to radical etching.
  • Plasma density and uniformity can be controlled by optimizing magnetic field.
  • Simple configuration makes maintenance easy.


  • Ultra-high frequency devices, optical devices (LEDs, LDs)
  • Next-generation non-volatile memory
  • Biochips and microfluid devices
  • Photonic crystals
  • Sensors, MEMS (micro-electromechanical systems)


Item Specification
System configuration R&D/prototype system with Load Lock function
Substrate size Up to 150 mm
Operating pressure (Pa) 0.07 to 6.7
Uniformity within substrate/substrate to substrate surfaces ±3% max.
Substrate temperature control Electrostatic chuck

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