Etching System
High-Density Plasma
High-Density Plasma
Etching System for R&DNE-550EX
NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
Features
- Equip with low-pressure, low-electron-temperature and high-density plasma source.
- Supports wide range of process control from ion etching to radical etching.
- Plasma density and uniformity can be controlled by optimizing magnetic field.
- Simple configuration makes maintenance easy.
Applications
- Ultra-high frequency devices, optical devices (LEDs, LDs)
- Next-generation non-volatile memory
- Biochips and microfluid devices
- Photonic crystals
- Sensors, MEMS (micro-electromechanical systems)
Specifications
| Item | Specification |
| System configuration | R&D/prototype system with Load Lock function |
| Substrate size | Up to 150 mm |
| Operating pressure (Pa) | 0.07 to 6.7 |
| Uniformity within substrate/substrate to substrate surfaces | ±3% max. |
| Substrate temperature control | Electrostatic chuck |
