Dry Etching System
Model：uGmni-200E
A versatile etching system that supports both single-chamber and multi-chamber configurations, offering cost performance and scalability for production scale.
Features
- Equipped with a "star electrode" to prevent deposits from adhering to the RF input window. Heating function enhances reproducibility and stability.
- Uniformity control is possible by adjusting the RF distribution ratio to a dedicated inner and outer perimeter separated antenna with ISM-duo (optional).
- A process chamber capable of handling gas flow rates up to twice that of our standard models (optional).
- High-temperature heating for the process chamber is selectable (optional).
- Additional etching chambers and ashing chambers can be equipped.
- The ashing chamber offers microwave water plasma treatment on a heated stage to prevent corrosion after metal etching.
- The system’s simple structure ensures easy maintenance.
- A dummy cassette and alignment mechanism can be added, enabling the system to support a variety of processes as a production tool.
- Comprehensive support services, including cleaning, parts supply, maintenance, and training, are provided.
Applications
- Compound semiconductors (LED, LD, VCSEL RF devices and communication devices), Power devices (IGBT, SiC)
- Metal, Dielectric, Polymer, Gate electrode etching
- Ferro electric material, Noble metal etching
- Ferro magnetic material etching
