Ashing System
Model： NA
The ashing system is available in two types: one designed for wafers and the other for panels.
The wafer-compatible model features a wafer-size-free design, capable of handling a wide range of processes from next-generation wafer processes to wafer-level packaging. It is the most widely adopted device in semiconductor packaging processes.
The panel-compatible model supports panels up to 600mm square, allowing for uniform Descum processing and Ti etching even on large panels.
Features
Model: NA-8000 and 1300
- Enables damage-free ion implant stripping and polymer removal processes.
- The chamber configuration optimized for F-based gas addition processes allows particle-free operation. This makes it suitable for a wide range of processes, including normal PR, ion implant stripping, organic film stripping (PI, DFR, etc.), and oxide etching.
- Simple design ensuring excellent maintenance, reliability, and cost-efficiency.
- The option to choose from different chamber configurations (μ-wave, RIE, μ-wave + RIE) allows optimal settings based on the process.
- Easy wafer size change through recipe settings.
Model： NA-1500
- Selectable microwave downflow and/or RF bias.
- Suitable for Ti seed layer etching, Descum, and surface treatments.
- Supports new processes such as surface treatment and hydrophilization, in addition to ashing.
Applications
- High dose ion implant stripping process (10E + 16 atoms/cm2 or higher) and polymer removal in front end process
- Wafer process that requires CF4 addition process (electronic parts and LEDs)
- Chip size package and bump process
- CCD color filter manufacturing process
- Descum, Desmear
- Surface modification (hydrophobic to hydrophilic, hydrophilic to hydrophobic), pre-treatment for wet processes such as plating and underfill
- Ashing of resin-based materials
Specifications
| Model | NA-8000 | NA-1300 | NA-1500 |
| Wafer Size（mm） | Φ100～200 | Φ200 and Φ300 | Max. 600mm square |
| Process chamber | 1 | 2～6 | 2 |
| Plasma Source | MW、RF | MW、VHF、RF | |
| Applications | R&D～Small-scale production | Large-scale production | Panel level packaging(PLP) |
