ICEP-IAAC 2025 will be held from April 15 to 19, 2025, in Nagano, Japan. As the largest international conference on electronic packaging in Japan, it is emerging as a premier event in the field, bringing together leading figures from the global electronics industry, academia, and research institutions. The event will feature over 230 oral and poster presentations, setting a new record for ICEP. This conference provides an excellent platform for researchers and engineers from both academia and industry worldwide to address new challenges and explore future research directions in electronics packaging.
ULVAC will present on the ion gun technology used for substrate surface cleaning and etching. The ULVAC Group is participating as a Gold Sponsor and is also contributing to the conference's organization as a member of the ICEP Technical Program Committee and Operation Committee.
| DATE | April 15 (Tue.) - April 19 (Sat.), 2025 (JST) |
|---|---|
| LOCATION | Wakasato Municipal Cultural Hall, Nagano Pref., Japan |
| PRESENTATION DATE | April 17, 2025 |
| TIME | 12:45 - 13:10 (JST) |
| SESSION | TA2: Glass PKG-1 |
| PRESENTAION TITLE | "Pre-treatment for Adhesion Layer in Panel-Level Sputtering Applying an Improved Linear Ion Source" |
External Links
https://www.jiep.or.jp/icep/
https://www.jiep.or.jp/icep/program.html
Internal Links
https://www.ulvac.co.jp/en/
https://www.ulvac.co.jp/special/en/plp/
For further information
ULVAC, Inc. web_info
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