ULVAC offers deposition and etching technologies as used in next generation packaging processes, such as PLP (Panel Level Packaging), PCB (Printed Circuit Board).

WLP, FOWLP and Panel Processing Increase Parallelism and Reduce Cost

NA-series Process Performance

  • Low temperature process:Applicable to panel size
  • Low damage by microwave plasma down-flow processing
    (Substrate bias:Optional)
  • Substrate size:Approx. □500㎜
  • Correspond to surface modification process
  • Safety:S2-0200
  • Host communication:SECS-2,GEM,GEM-300 (Optional)

NA-series Process Performance

Descum Process (Resist  sample)
Surface modification Process
Inquiry about Panel Level Packaging