ULVAC offers deposition and etching technologies as used in next-generation packaging processes, such as SoC and SiP.
Dry Etching System for Opto-Devices, MEMS
Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.
Luminous NA Series
This ashing system can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
Cluster-type PE-CVD System
This is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.
Dry Etching System for Production
Dry etching system for high volume production with good cost performance and wide selection of tool configuration.
Highly uniform and stable deposition technology on an 8 inch wafer scale utilizing specially designed sputtering chamber for dielectric materials.
ULVAC unique and stable process allowing high performance PZT thin film in mass production scale under 500degrees.
Multi-chamber Sputtering System
MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.
Backside Metalization Sputtering System
This is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.