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ULVAC offers deposition and etching technologies as used in next-generation packaging processes, such as SoC and SiP.

TSV Through Silicon Via

Dry Etching System for Opto-Devices, MEMS
NLD-5700

Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

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NLD-5700

Ashing System
Luminous NA Series

This ashing system can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

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NA-1300

Cluster-type PE-CVD System
CME-200E/400

This is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.

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eiシリーズ

Dry Etching System for Production
NE-5700/NE-7800

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

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NE-5700

Sputtering System
SME-200

Highly uniform and stable deposition technology on an 8 inch wafer scale utilizing specially designed sputtering chamber for dielectric materials.
ULVAC unique and stable process allowing high performance PZT thin film in mass production scale under 500degrees.

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SME-200E

Multi-chamber Sputtering System
MLXTM-3000N

MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

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NE-550EX

Backside Metalization Sputtering System
SRH Series

This is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

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CC-200/400
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