Sputtering Targets
for Flat Panel Display Applications

Features

• We support sputtering targets for all fields, including TFT, OLED (LTPS: Low-temperature polysilicon), and touch panels.
• ULVAC has installed large ultrasonic test equipment to conduct meticulous defect inspections of materials and bonding inspections. This equipment has helped ULVAC drastically reduce arcing during sputtering and deliver high-quality targets.
• Ultrasonic defect testers ensure meticulous quality assurance.
• High-Reliability Metal Bonding Technology
  Large sputtering targets are very heavy, so technology for bonding to a cooling plate (backing plate) is extremely important. ULVAC has installed bonding equipment near customers in various Asian countries to support the deposition of larger glass substrates, realizing an all-inclusive target supply system.
• Low-Particle Targets:
• Attaining high uniformity by adjusting the metal microstructure.

Cu-Mg-Al Alloy for Low-Resistance Copper Wiring

• Ideal target for deposition forming in low-resistance wiring processes. The stacking structure uses a Cu-Mg-Al alloy as an adhesion layer and as an oxidation suppression barrier layer for pure copper film.
• Wet etch processing is easy because the copper material is similar to the wiring layer material. Processing can also use an etching solution (single fluid) not containing hydrogen peroxide or fluoric acid.

Sputtering Targets for FPD