ULVAC, Inc. will deliver an invited talk on advanced process and equipment technologies for semiconductor packaging at the Semiconductor Packaging Workshop 2026.
| Date | June 1 (Mon) - June 2 (Tue), 2026 (EDT) |
|---|---|
| Location | Penn State University, University Park, Pennsylvania, USA |
| Presentation Date | June 1 (Mon), 2026 |
|---|---|
| Session Title | Equipment and Tools for Advanced Packaging |
| Presentation Title | Plasma Technology Solutions for Fine RDL Interposer and Co-Packaged Optics |
Related Information
CHIMES Official Website
CHIMES Newsletter - Q1 2026
For further information
ULVAC, Inc. web_info
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