ULVAC, Inc. has been participating since 2022 in the Chiplet Integration Platform Consortium at Institute of Science Tokyo.
Through this consortium, ULVAC will present its low-warpage multilayer RDL technology using dry film and fine via etching processes at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC 2026), the world's largest conference on semiconductor packaging.
| Date | May 26 (Tue) - May 29 (Fri), 2026 (EDT) |
|---|---|
| Location | JW MARRIOTT Orlando Grande Lakes, Orlando, Florida, USA |
| Presentation Date | May 29 (Fri), 2026 |
|---|---|
| Time | 11:55 a.m. - 12:15 p.m. (EDT) |
| Session Title | Session 27: Innovation in Glass and Dielectric Materials for Heterogeneous Integration |
| Presentation Title | Low-Warpage Multilayer RDL Technology Using Thin Dry Film Dielectric with Reduced Curing Shrinkage and Dry Etched Ultrafine Via |
External Links
IEEE-ECTC 2026 https://ectc.net/
Related Information
Institute of Science Tokyo: Chiplet integration technology with simplest scheme
For further information
ULVAC, Inc. web_info
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