The IEEE Hybrid Bonding Symposium (HBS 2026) will be held from January 22 to 23, 2026, in Milpitas, CA, USA.
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come.
At the symposium, ULVAC will deliver a technical presentation titled "Technology of Cleaning and Activation Using Surface Wave Excited Plasma Downstream for Hybrid Bonding."
| Date | January 22 (Thu) - 23 (Fri), 2026 (PST) |
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| Location | SEMI Headquarters, Milpitas, CA, USA (Silicon Valley) |
| Presentation Date | Friday, January 23, 2026 |
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| Time | 10:00 a.m. - 10:30 a.m. (PST) |
| Session Title | Hybrid Bonding Processes & Materials (I) |
| Presentation Title | Technology of Cleaning and Activation Using Surface Wave Excited Plasma Downstream for Hybrid Bonding |
External Links
IEEE Hybrid Bonding Symposium
https://attend.ieee.org/hbs/?page_id=779
For further information
ULVAC, Inc. web_info
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