IEEE EPTC 2025―Singapore's largest international conference on advanced packaging, organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS)―will be held at Resorts World Sentosa, Singapore from Tuesday, December 2 to Friday, December 5, 2025.
The ULVAC Group will also participate in this event as a Bronze Sponsor.
ULVAC will deliver an invited talk titled "Technology scaling evolution of interposer interconnects for glass core and high-density polymer RDL based on plasma dry processes."
| Date | December 2 (Tue) - 5 (Fri), 2025 (SGT) |
|---|---|
| Location | Resorts World Sentosa, Singapore |
| Presentation Date | Thursday, December 4, 2025 |
|---|---|
| Time | 10:15 a.m. - 10:45 a.m. (SGT) |
| Session Title | Invited Talk 2 |
| Presentation Title | Technology scaling evolution of interposer interconnects for glass core and high-density polymer RDL based on plasma dry processes |
External Links
https://eptc-ieee.net/
https://eptc-ieee.net/uploads/exhibitors-pdf/691ff85d2b9f5_invited_speakers_2025_v7.pdf
For further information
ULVAC, Inc. web_info
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