ICEPT 2025 will take place from August 5 to 7, 2025, in Shanghai, China.
The International Conference on Electronic Packaging Technology (ICEPT) is recognized as one of the leading academic conferences on electronic packaging in China. It is jointly organized by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), the IEEE Electronics Packaging Society (IEEE-EPS), the Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics (CIE-EMPT), and Shanghai University.
ULVAC will deliver a plenary speech and an invited talk during the technical session, both focusing on advanced packaging technologies.
| Date | Tuesday, August 5 - Thursday, August 7, 2025 (CST) |
|---|---|
| Location | Sheraton Shanghai Jiading Hotel, Shanghai, China |
Plenary Speech
| Presentation Date | Thursday, August 7, 2025 |
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| Time | 9:00 AM - 9:30 AM (CST) |
| Session Title | Plenary Speech (Invited talk) |
| Presentation Title | Manufacturing Transformation Era: Process Solutions for Wafer and Panel-Level Packaging Driven by Semiconductor Process Technology |
Invited Talk
| Presentation Date | Thursday, August 7, 2025 |
|---|---|
| Time | 3:00 PM - 3:30 PM (CST) |
| Session Title | Special Session II : ICEP Session (Invited talk) |
| Presentation Title | Application of Magnetic Neutral Loop Discharge Plasma in Deep Etching of Low-CTE Glass Substrate for Co-Packaged Optics |
External Links
https://www.icept.org/news_complex.aspx?nid=2
https://www.icept.org/
Internal Link
https://www.ulvac.co.jp/products/etching_system/nld-570/index.html
For further information
ULVAC, Inc. web_info
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