The 2025 IEEE 75th Electronic Components and Technology Conference (ECTC 2025)|News|ULVAC, Inc.
  • TOP
  • News
  • The 2025 IEEE 75th Electronic Components and Technology Conference (ECTC 2025)
2025.04.25
News

The 2025 IEEE 75th Electronic Components and Technology Conference (ECTC 2025)

ECTC 2025 will be held from May 27 to 30, 2025, in Dallas, Texas, USA.
It is one of the largest and most comprehensive annual conferences on semiconductor technology in the world. The 2025 conference will mark its 75th edition.
ULVAC will deliver five technical presentations on advanced packaging.

Date May 27-30, 2025 (CDT)
Location Gaylord Texan Resort & Convention Center, Dallas, Texas, USA

Presentation Date Wednesday, May 28, 2025
Time 3:45 PM - 4:05 PM (CDT)
Session Title Session 8 - Novel Structures and Processes for Chip-to-Wafer Hybrid Bonding
Presentation Title Direct Transfer Bonding Technology Enabling 50-nm Scale Accuracy for Die-to-Wafer 3D/Heterogeneous Integration

Presentation Date Thursday, May 29, 2025
Time 10:00 AM - 12:00 PM (Noon) (CDT)
Session Title Session 39 - Interactive Presentations 3
Presentation Title Polyimide Fine Via and Trench Formation Based on Plasma Etching Technology for RDL Interposer

Presentation Date Thursday, May 29, 2025
Time 2:00 PM - 2:20 PM (CDT)
Session Title Session 20 - Novel Technologies for High Density RDL Interposers
Presentation Title Pillar-Suspended Bridge (PSB); Transmission Simulation and Fabrication Process of 2-Micron Diameter / 5-Micron Pitch Dry Etched Stacked Via in Low-k Polymer for High Performance RDL Bridge

Presentation Date Thursday, May 29, 2025
Time 4:45 PM - 5:05 PM (CDT)
Session Title Session 20 - Novel Technologies for High Density RDL Interposers
Presentation Title High-Density RDL Fan-Out with L/S 2/2μm Dry-Etched Micro Vias for Agile Prototyping/Low-Volume Production and TAT/NRE Cost Modeling

Presentation Date Friday, May 30, 2025
Time 9:30 AM - 9:50 AM (CDT)
Session Title Session 26 - Process Innovation in Through-Via and Solder Interconnections
Presentation Title Deep Via and Trench Etching of Low CTE Glass Package Substrate Using SF6, NF3 and H2O Based NLD Plasma Process

External Links

https://www.ectc.net/
https://www.ectc.net/program/75-ECTCAdvance-Web.pdf?=123

For further information

ULVAC, Inc. web_info

This website use cookies to obtain and use access data to understand the convenience and usage of customers. If you agree to use cookies, click "I Accept".
[Privacy Plicy] [Cookie Policy]

I Accept