ULVAC Receives "Best Interactive Presentation Award" at The 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

ULVAC, Inc. recently presented at the IEEE 74th Electronic Components and Technology Conference (ECTC), held in Denver, Colorado, USA, from May 28 to 31, 2024. The presentation, titled "A Novel Plasma Etching Technology of RIE-lag Free TSV and Dicing Processes for 3D Chiplets Interconnect," was recognized for its academic and technical excellence and received the "Best Interactive Presentation Award."

Details of the award can be viewed at the following link.
ECTC Website: https://www.ectc.net/about/74highlights.cfm

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