The International Conference on Semiconductor, Advanced Metallization Conference 2024, 33rd Asian Session (ADMETA plus 2024), organized by the Japan Society of Applied Physics, will be held at the Takeda Hall, The University of Tokyo, and online from Wednesday, October 3 to Friday, October 4, 2024.
ADMETA plus 2024 is an international conference on interconnect technology for advanced logic and memory devices.
ULVAC will give an invited talk about advanced packaging, titled "Advanced Panel Level Packaging Process Based on Plasma Etching Technology for 3D Chiplets Integration."
| DATE | October 3 - 4, 2024 (JST) |
|---|---|
| LOCATION | Takeda Hall, The University of Tokyo, Japan |
| PRESENTATION DATE | October 4, 2024 |
| TIME | 10:00 - 10:30 (JST) |
| SESSION | Session 7) Advanced Packaging |
| PRESENTATION TITLE | "Advanced Panel Level Packaging Process Based on Plasma Etching Technology for 3D Chiplets Integration" |
External Links
https://www.admeta.org/en/index-en?p_year=2024
https://www.admeta.org/en/cpt_admeta/program-2024-en
For further information
ULVAC, Inc. web_info
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