ICEPT 2024 will be held in Tianjin, China, August 7-9, 2024.
The International Conference on Electronic Packaging Technology (ICEPT) has been recognized as one of the top electronic packaging academic conferences in China, which is hosted by Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), IEEE Electronics Packaging Society (IEEE-EPS), Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT), and Tiangong University. This conference is held annually, and 2024 will be the 20th time it has been held.
ULVAC will give an invited talk about advanced packaging. The title of the talk is "Manufacturing Technology Solution of WLP/PLP for Chiplet Integrations."
| DATE | August 7-9, 2024 (CST) |
|---|---|
| LOCATION | Social Hill International Conference Center Hotel, Tianjin, China |
| PRESENTATION DATE | August 8, 2024 |
| TIME | 16:20-16:50 (CST) |
| SESSION TITLE | Plenary Talk (Invited talk) |
| PRESENTATION TITLE | "Manufacturing Technology Solution of WLP/PLP for Chiplet Integrations" |
External Links
http://www.icept.org/news_complex.aspx?nid=2
For further information
ULVAC, Inc. web_info
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