ECTC 2024 will be held on May 28-31, 2024 in Denver, Colorado, USA.
ECTC 2024 is one of the largest and the most comprehensive annual semiconductor technology conferences in the world. This conference is held annually, and 2024 will be the 74th time it has been held.
ULVAC will be given two technical presentations about advanced packaging.
| DATE | May 28 - 31, 2024 (MST) |
|---|---|
| LOCATION | Gaylord Rockies Resort & Convention Center, Denver, Colorado, USA |
| PRESENTATION DATE | May 30, 2024 (MST) |
| TIME | 10:00 am ～ 12:00 pm (MST) |
| SESSION TITLE | Session：39 "Interactive Presentations 3" |
| PRESENTATION TITLE | "A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect" "Through dielectric via etching in magnetic neutral loop discharge plasma for 3D chiplets interconnect" |
External Links
For further information
ULVAC, Inc. web_info
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