CSTIC 2024 will be held on March 17-18, 2024 in Shanghai, China, in conjunction with SEMICON China 2024.
CSTIC 2024 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI and IEEE.
ULVAC will be given a technical presentation about advanced packaging, the entitle is "Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect".
| DATE | 2024. 3.17 - 2024. 3.18 |
|---|---|
| LOCATION | Shanghai International Convention Center, Shanghai, China |
| PRESENTAION DATE | 2024. March. 17 (Sunday) |
| TIME | 14:00～14:20 (CST) |
| SYMPOSIUM VII | Packaging and Assembly, Session I |
| SESSION TITLE | "3D and Advanced Packaging Technologies" |
| PRESENTAION TITLE | "Challenges of Semiconductor Micro Via Fabrication Technology for 3D Chiplet Interconnect" |
External Links
- https://www.semiconchina.org/en/137
- https://www.semiconchina.org/en/5
Reference sites
- https://www.titech.ac.jp/english/news/2022/065018
For further information
ULVAC, Inc. web_info
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