ULVAC is gold sponsor of ICEP 2023.

2023 International Conference on Electronics Packaging (ICEP), the most prestigious package conference in Japan, will be held from April 19-22, 2023. ULVAC is "Gold sponsor" of ICEP.

Date : April 19-22, 2023
Venue: Civic Auditorium Sears Home Yume Hall, Kumamoto
Official website : http://jiep.or.jp/icep/
Advance Program：https://www.jiep.or.jp/icep/pdf/Advance_Program.pdf

External Links
・http://jiep.or.jp/icep/
・https://www.jiep.or.jp/icep/pdf/Advance_Program.pdf

Related Website
・Dry ashing equipment for package
https://www.ulvac.co.jp/en/products/ashing_system/luminous_na_series/index.html

・Combined deposition and etch modules' system of cluster type for advanced electronics
https://www.ulvac.co.jp/en/products/sputtering_system/load_lock_type/uGmni-200300/index.html

further information
ULVAC, Inc. web_info