ULVAC launches "uGmni series", a single-wafer film deposition and processing system for advanced electronics manufacturing, customizable with a variety of modules that can be equipped onto the common transfer core|News|ULVAC, Inc.
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2021.01.29
News

ULVAC launches "uGmni series", a single-wafer film deposition and processing system for advanced electronics manufacturing, customizable with a variety of modules that can be equipped onto the common transfer core

ULVAC, Inc. (or "ULVAC", based in Chigasaki, Kanagawa JAPAN; CEO Setsuo Iwashita) today announced to launch "uGmni series", a single-wafer system for thin film deposition and processing. The cluster type system can be equipped with a variety of process modules such as sputtering and etching onto its common transfer core.

As manufacturing of advanced electronics uses a wide variety of processes such as film deposition and fine patterning, commonly, each process uses a specific system designated for such process.

The versatile "uGmni series" platform can equip a variety of process modules, improving efficiency in the manufacturing process. It also utilizes common parts to reduce spare parts, along with using the same operation panels to improve usability.

Overview of the uGmni series

[Features]

・Able to combine various process chambers: sputtering, etching, ashing and PE-CVD
 *Certain combinations may be unavailable depending on the process, so please consult with us.

・All above modules to be manufactured by ULVAC
・Compatible with wafers up to Φ300 ㎜

[Applications]
・Power device: seed and metal layer sputtering
・MEMS sensor: PZT sputtering and etching
・Optical device: VCSEL etching
・Packaging: descum ashing
・Communication device: PE-CVD of insulated film and etching

[Applicable wafer size]
 uGmni-200 series MaxΦ200mm
 uGmni-300 series MaxΦ300mm

[Transfer core]for Φ200 mm, please inquire for Φ300 mm
 Square: maximum 2 process modules
 Hexagon: maximum 4 process modules
 Heptagon: maximum 5 process modules

[Available process modules]
 Sputtering, etching, ashing, PE-CVD and others (manufactured by ULVAC)

System photo

gemini_200.pnguGmni-200, a single-wafer film deposition and etching system for advanced electronics manufacturing

System configurations

A variety of modules can be equipped, examples below.

gemini_core_e.png

*Certain combinations may be unavailable depending on the process, so please consult with us.

Product

https://www.ulvac.co.jp/en/products/sputtering_system/load_lock_type/uGmni-200300/index.html

For further information


ULVAC, Inc. elec_info
Advanced Electronics Equipment Division TEL:+81-467-89-2139

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