Sputtering System
Model：ENTRON-EX W300
The ENTRON-EX W300 is a versatile, multi-chamber platform designed to support the fabrication of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging.
By integrating a variety of process modules such as PVD, pre-clean, heating, and cooling it can flexibly adapt to customer needs.
This is the legacy model of the ENTRON-EXX.
Features
- A long-selling model widely adopted in mass production, continuously improved to enhance fabrication capability, space efficiency, and operational stability.
- The ENTRON-EX Single Core type is ideal for mini-fab concepts, while the ENTRON-EX Tandem Core type is optimized for high-volume production, offering flexible solutions tailored to customer needs.
- Capable of accommodating up to 10 modules (PVD, pre-clean, heating, cooling).
- Achieves a mechanical throughput of more than 100 WPH using ULVAC’s proprietary transfer robot.
- Equipped with the EES system for real-time monitoring and management of machine conditions.
Applications
- Fabrication of semiconductors: Logic, DRAM, NAND and NVM
Deposition processes for semiconductor fabrication, including metal interconnect, patterning mask, electrode, and other functional films.