NANOMETAL INKs are produced by the Gas Evaporation Method. These newly developed inks consist of metal nanoparticles dispersed stably and not aggregated in some organic solvent. The inks enable to form electro-conductive fine patterns directly by printing processes such as ink-jet printing.
Au NANOMETAL INK enables to form Au films at the curing temperature of 250℃.
Au NANOMETAL INK (Solvent: Toluene)
Au NANOMETAL INK (Solvent: Cyclododecene) Ink-jet Type
TEM image of Au nanoparticles dispersed in Au NANOMETAL INK Average particle size is 3.6nm
■Particle size distribution of Au NANOMETAL INK
■Electric resistivity vs. curing temperature of Au NANOMETAL INK films
■Au film formed by Au NANOMETAL INK
Product Name | Au NANOMETAL INK | Ag NANOMETAL INK |
Ag NANOMETAL INK |
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Grade | Au1T | Au1Chb | Ag1T | Ag1TeH | L-Ag1T | L-Ag1TeH |
For Ink-Jet | X | ○ | X | ○ | X | ○ |
Metal concentration(wt%) | 30 | 50-60 | 30 | 50-60 | 30 | 50-60 |
Solvent | Toluene | Cyclohexylbenzene | Toluene | Tetradecane | Toluene | Tetradecane |
Average Particle Size (nm) |
3-8 | 3-8 | 3-8 | |||
Viscocity (mPa・s) | <5 | 5-15 | <5 | 5-15 | <5 | 5-15 |
Coating characteristic | ||||||
Curing Condition | 250℃×60min (in Air) | 230℃×60min (in Air) | 150℃×60min (in Air) | |||
Thickness(μm) | <1 | <1 | <1 | |||
Resistivity (μΩ・cm) | approx.8 | approx.20 | approx.3 | approx.10 | ||
Substrate to be used |
Heat-resistant temperature of substrates should be higher than sintering temperature. (example:polyimide, glass, metal, ceramic etc.) |
Specifications are subject to change.
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