Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.
Model | RISETM-300 | |
Plasma Source | Microwave Power Supply | |
Configuration | EFEM + LL + PM | |
Wafer Size | 300mm diameter | |
Wafer Stage | Ceramic Board (50 wafers/batch) | |
Pumping System | Etching Module:Mechanical booster pump +DRP | |
Control System | FAPC+TFT Touch Panel | |
Gas Supply | 3 lines | |
Application | Pretreatment for SAC, Capacitor, Epitaxial growth |
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