The Technology Award from JIEP

ULVAC's plasma processing technology for high-density packaging received the Technology Award from the Japan Institute of Electronics Packaging（JIEP）.
This award recognizes technologies that the academic society has made a significant contribution to the development of electronics packaging technology.

We gave an invited talk on June 4th.

Theme：
"The Novel Ashing and Etching Technology for Fan-Out Wafer Level Package"

External Links（Japanese site）

• https://web.jiep.or.jp/about/winners/2020winners.pdf
• https://web.jiep.or.jp/about/awards.html
• https://web.jiep.or.jp/about/awards-technology.html

ULVAC Product Links

• https://www.ulvac.co.jp/en/products/ashing_system/index.html
• https://www.ulvac.co.jp/en/products/applications/advanced_packaging_device/index.html

For further information

ULVAC, Inc. web_info