The Japan Society of Applied Physics (JSAP) Spring Meeting will be held in the Tokyo City University from March 22 to 25. A hybrid event will be held this year, too.
ULVAC will give an invited talk about advanced packaging technologies, the entitle is "Development of 3D・chiplet integration technologies for the AI and IoT".
Please join us!
| DATE | 2024. 3. 22 (Fri) |
|---|---|
| TIME | 1:40pm～2:10pm (JST) |
| LOCATION | Setagaya Campus, Tokyo City University & On-line |
| CATEGORY | 13. Semiconductor |
| PRESENTATION INFORMATION | Oral Presentation (Invited) | Room 61C |
| SYMPOSIUM TITLE | "Progress in the semiconductor industry contributing to expand IoT market and what's core technologies ?"(Organize：The Study Group of the Integrated MEMS of the JSAP) |
| INVITED TALK TITLE | "Development of 3D・chiplet integration technologies for the AI and IoT" |
External Links
- https://meeting.jsap.or.jp/english/symposium
For further information
ULVAC, Inc. web_info
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