Sputtering System

ULVAC’s sputtering systems have been widely adopted across various industies.

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  Model: ENTRON-EXX

  The system is a versatile, multi-chamber platform designed to support the production of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging.

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  Model：uGmni-300S

  Multi-Chamber Sputtering System for High-Volume Production of Power, Opto, and RF Devices.

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  Model： SME

  Multi-Chamber Sputtering System for Opto Devices, Packaging, MEMS/Electronic Components, Power Devices, and Communication Devices

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  Model： SRH

  Production-Scale Multi-Chamber Sputtering System Optimized for Packaging and Power Devices Applications.

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  Model:SEGul-200

  Multi-Chamber Sputtering System for High-Volume Production of GaN Devices for Power, Opto, and RF Applications.

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  Model： CS

  Single-Chamber Sputtering System for R&D to Small-Scale Production.

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  Model： SMV

  Multi-Chamber Vertical Sputtering System for Ti/Cu Seed Layer Formation in PLP Packaging.

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  Model：SIV, SCV

  In-line Vertical Sputtering System Suitable for Deposition of Various Materials on a Wide Range of Substrates.

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  Model： SIH, SCH

  In-line Sputtering System Suitable for Deposition of Various Materials on a Wide Range of Substrates.

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  Model： SV

  High-Throughput Batch-Type Drum Sputtering System.

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  Model： SMD

  This is one of the Model: SMD with a total sales record of over 1,400 units. It is a multi-chamber sputtering system primarily used in the high-definition display industry.

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  Model： SMD

  This is one of the Model: SMD with a total sales record of over 1,400 units. It is a In-line sputtering system primarily used in the large display industry.

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