ULVAC, Inc. will deliver an invited presentation at the 24th International Symposium on Microelectronics Packaging (ISMP 2026), one of the largest international conferences in the field of semiconductor packaging in Korea. In addition, ULVAC will serve as a session chair in the ICEP Session, organized in collaboration with ICEP, an international conference on advanced packaging technologies in Japan.
ISMP 2026 is an international conference on semiconductor back-end processes and packaging technologies organized by the Korean Microelectronics and Packaging Society (KMEPS). This year's 24th symposium will be held in Busan, Korea, bringing together experts from the semiconductor and electronics industries to discuss the latest packaging technologies, materials, processes, and reliability.
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Conference
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The 24th International Symposium on Microelectronics Packaging (ISMP 2026)
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| Dates |
November 3-6, 2026 (KST)
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| Venue |
Paradise Hotel Busan (Busan, Korea)
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Invited Presentation
| Date & Time |
Wednesday, November 4, 2026, 16:55 - 17:20 (KST)
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| Venue |
Panorama Room (60), 16F
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| Session |
ICEP Session
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| Presentation Title |
Development of PVD Sputtering Technology and Equipment for Seed-Layer Formation in Through-Glass Vias for Advanced Packaging
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| Abstract |
Semiconductor packages for generative AI and high-performance computing require high-speed, low-loss signal transmission enabled by high-density and shorter interconnects. In addition, larger package sizes create challenges in suppressing warpage and improving yield and productivity. Glass cores are expected to serve as next-generation package substrates owing to their coefficient of thermal expansion close to that of Si, high rigidity, excellent flatness, and low dielectric loss. However, forming interconnects in through-glass vias (TGVs) within glass cores by Cu electroplating requires continuous underlayers and conductive seed layers on the TGV sidewalls. In this presentation, we report a PVD sputtering technology capable of depositing films deep into high-aspect-ratio TGVs.
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| Affiliation |
Institute of Advanced Technology, ULVAC, Inc.
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Related External Site
For further information
ULVAC, Inc. web_info
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