ULVAC, Inc. will deliver an invited presentation at the 21st International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2026), one of the largest international conferences in the field of semiconductor packaging in Taiwan. In addition, ULVAC will serve as a session chair in the ICEP Session, organized in collaboration with ICEP, an international conference on advanced packaging technologies in Japan.
IMPACT-IAAC 2026 is an international conference on advanced packaging technologies organized by IEEE-EPS Taipei, iMAPS Taiwan, ITRI, and TPCA. This year's conference will be co-hosted with the iMAPS All Asia Conference (IAAC), bringing together key leaders and experts in advanced packaging from across Asia.
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Conference
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21st International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-IAAC 2026)
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| Dates |
October 19-22, 2026 (CST)
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| Venue |
Grand Hilai Taipei (Taipei, Taiwan) - October 19
Taipei Nangang Exhibition Center II (Taipei, Taiwan) - October 20-22
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Invited Presentation
| Date & Time |
Tuesday, October 20, 2026, 10:58 - 11:22 (CST)
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| Venue |
Taipei Nangang Exhibition Center II (701F, 7F, TaiNEX 2)
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| Session |
Advanced Packaging ~ Hybrid Bonding, Glass Core, Fine RDL ~ (ICEP)
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| Presentation Title |
Development of PVD Sputtering Technology and Equipment for Seed-Layer Formation in Through-Glass Vias for Advanced Packaging
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| Affiliation |
Advanced Technology Research Institute, ULVAC, Inc.
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Related External Site
IMPACT-IAAC 2026 Official Website
For further information
ULVAC, Inc. web_info
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