Presentation on the Development of an Aluminum Nitride Thin Film Process for Heat Spreader Applications at ADMETA2026

ULVAC, Inc. will present a poster on the development of an aluminum nitride (AlN) thin film process for heat spreader applications at the Advanced Metallization Conference (ADMETA2026), to be held at Takeda Hall, The University of Tokyo, from October 7 to 9, 2026.

Conference Name	Advanced Metallization Conference (ADMETA2026)
Dates	Wednesday, October 7 - Friday, October 9, 2026
Venue	Takeda Hall, The University of Tokyo (Bunkyo-ku, Tokyo)

Poster Presentation

Date & Time	Thursday, October 8, 2026, 18:30 - 20:00
Session	Materials Science and Technology
Presentation Title	Development of Aluminum Nitride Thin Film Deposition Process for Heat Spreader Applications
Abstract	In recent years, the increasing heat generation associated with higher integration and performance of semiconductor devices has become a critical challenge. To address this issue, ULVAC has been developing high-thermal-conductivity PVD aluminum nitride (AlN) thin films. AlN films were deposited by reactive sputtering using an Al target and characterized in terms of crystallinity, impurity concentration, surface roughness, and thermal conductivity measured by the time-domain thermoreflectance (TDTR) method. Our previous studies revealed that the thermal conductivity of AlN strongly correlates with the c-axis crystallinity, and that improving the c-axis orientation significantly enhances the thermal conductivity. Furthermore, we established a process for controlling the film stress while maintaining high thermal conductivity. In this presentation, we report the deposition process and material properties of PVD-AlN thin films that achieve both high thermal conductivity and controlled film stress.
Affiliation	ULVAC, Inc.

Related External Site

Official Website of ADMETA2026

For further information

ULVAC, Inc.　web_info