The 27th International Conference on Electronic Packaging Technology (ICEPT 2026) will be held in Xi'an, China, from August 5 to 7, 2026.
Recognized as one of China's leading international conferences on electronic packaging technology, ICEPT is hosted by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), the IEEE Electronics Packaging Society (IEEE-EPS), the Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics (CIE-EMPT), and Xi'an Jiaotong University.
During the special session "International Hybrid Bonding Technology," ULVAC will deliver an invited presentation titled "Plasma Activation in the Downstream Region of a Surface-Wave-Excited Plasma for Hybrid Bonding."
| Date | August 5 (Wed)-7 (Fri), 2026 (CST) |
|---|---|
| Location | Wyndham Grand Xi'an South, China |
| Presentation Date | August 5 (Wed), 2026 |
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| Time | 13:00-16:15 (CST) |
| Session Title | International Hybrid Bonding Technology |
| Presentation Title | Plasma Activation in the Downstream Region of a Surface-Wave-Excited Plasma for Hybrid Bonding |
External Links
ICEPT 2026 https://www.icept.org/
For further information
ULVAC, Inc. web_info
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