The International Plasma Technology Joint Conference 2025 (IPTJC2025) will be held from June 25 to 28, 2025, at Ming Chi University of Technology in New Taipei, Taiwan.
This prestigious event brings together researchers and engineers from around the world and integrates three renowned international conferences: the Global Plasma Forum (Japan), the International Workshop on Plasma Cryo Etching Processes (PlaCEP) (Europe), and the International Forum on Plasma and Thin Film Technologies for Sustainable Development Goals (PTSDG) (Taiwan).
The conference will cover a wide range of topics including plasma science, plasma etching, coating, thin films, surface engineering, and surface modification. It is a significant platform for experts from academia, industry, and research institutes to share and exchange cutting-edge developments.
ULVAC will deliver an invited talk on advanced silicon etching technology, titled: "A Novel Plasma Etching Technology of Silicon using Dual Frequency Inductively Coupled Plasma."
| DATE | Wednesday, June 25 - Saturday, June 28, 2025 (CST) |
|---|---|
| LOCATION | Innovation Building, Ming Chi University of Technology, New Taipei, Taiwan |
| PRESENTATION DATE | Thursday, June 26, 2025 |
| TIME | 2:50 pm - 3:10 pm (CST) |
| SESSION | Symposium A: Cryogenic Plasma and Low-Temperature Etching Technology |
| PRESENTAION TITLE | A Novel Plasma Etching Technology of Silicon using Dual Frequency Inductively Coupled Plasma |
External Links
https://iptjc2025.conf.tw/site/page.aspx?pid=901&sid=1618&lang=en
https://iptjc2025.conf.tw/site/page.aspx?pid=207&sid=1618&lang=en
https://drive.google.com/file/d/1ARbNmQ_6XVOzRvK7yHTeTVbA68czVA4P/view
For further information
ULVAC, Inc. web_info
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