Pachen’s Law is a principle that describes the voltage at which a spark discharge occurs. When a strong electric field is applied to gas, it eventually leads to breakdown and spark discharge.
… What is Paschen’s Law?

As we progress into the future, the demand for high-performance devices in the areas of mobile, automotive, HPC, IoT, and server will most definitely continue to increase. Products in such industries require greatly diverse structures, depending on their desired function. … Different types of semiconductor packaging

A build-up layer is the wiring layer of the substrate that utilizes build-up wiring. … What is a build-up layer?

Plasma is the volume exceeding the average distance covered by the interaction between the two charged particles, in a system containing two or more charged particle groups of different signs of charge, where at least one of which is undergoing irregular thermal motion.

… What is plasma?

AC sputtering is a discharge system often used for high-resistance targets. It has a benefit of suppressing charge-up damage of the target surface, as two targets are discharged alternately.

… What is AC (alternating current) sputtering?

DC sputtering is a discharge method in which a current has a constant voltage and a fixed flow direction.
… What is DC (direct current) sputtering?

Sputtering is a method of thin film deposition, which is a type of PVD (physical vapor deposition).
… What is sputtering?

T/S distance is the distance between the cathode and the substrate in a sputtering equipment, or more precisely, from the target surface of the cathode to the substrate. … What is the T/S distance?

Step coverage refers to the state of film coverage when a film is deposited on an uneven surface of a substrate (the surface perpendicular to the evaporation source) by sputtering, vapor deposition, etc.  … What is step coverage?