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DC sputtering is a discharge method in which a current has a constant voltage and a fixed flow direction.
In sputtering, voltage must be applied to a cathode and an anode to generate a glow discharge. DC discharge allows sputtering of metal targets such as Aluminium (Al), Titanium (Ti), Copper (Cu) and Molybdenum (Mo). However, it cannot discharge insulator targets such as Silicon dioxide (SiO2) and Aluminium oxide (Al2O3).