IMPACT2022 conferenceにおいて、招待講演の機会を頂きました。
学会開催日 : 2022/10/26 (Wed) – 10/28 (Fri)
講演日時 : 2022/10/26 13:10～15:10 ※JIEP Session 内、講演時間 30min
講演題目 : Plasma technique for advanced package product
講演者 : 株式会社アルバック 電子機器事業部 第2技術部2課 廣庭 大輔
Link : https://www.impact.org.tw/site/order/1283/SessionDetail.aspx?sid=1283&lang=en&snid=OS1&rmid=S3
講演内容要約 : As electronics devices becomes more high performance, energy efficient, and diversified, more complex and finer packaging structures and more diversified materials are being actively studied. Against this background, plasma technology is being actively employed in the manufacturing process of high-density packaging products. In this presentation, I will introduce various plasma processing technology for advanced package product.